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  • Rapid, tool-less connection of single wires with Insulation Displacement Connection (IDC)
  • Low processing costs with automatic mount (SMT) and reflow soldering process
  • High level of rigidity on the PCB with side, large-area SMT fixings
  • Low overall height of only 5 mm on the PCB
  • High packing density through small size pitch of 1.27 mm
Har Flexicon
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