Single-point Probes available for small land area contact pads
Signal path during test only 0.077 [1.96]
Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws
The Au over Ni plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls
Standard molded socket format can accommodate any device package of 40mm or smaller
Pressure pad compression spring provides proper force against device and allows for height variations in device thickness
