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Test Socket

  • Any pitch device on 0.30mm or larger
  • 4 Point crown insures “scrub” on solder oxides
  • Single-point Probes available for small land area contact pads
  • Signal path during test only 0.077 [1.96]
  • Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws
  • The Au over Ni plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls
  • Standard molded socket format can accommodate any device package of 40mm or smaller
  • Pressure pad compression spring provides proper force against device and allows for height variations in device thickness
High Frequency Test Socket
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