Qualitek
Qualitek has developed several types of high-performance Delta Soldering Products, suitable for printing, dispensing and package-on-package assembly.
Delta Solder Paste
Qualitek has developed several types of high-performance Delta Solder Paste designed for use in Sn/Pb or for Pb-Free circuit board assembly. Qualitek offers No-Clean, RMA (Rosin Mildly Activated), RA (Rosin Activated) and Water-Soluble solder paste types for surface mount assemblies. Delta Solder Paste types are available for printing, dispensing and package-on-package assembly. Delta Solder Paste is available in jars, syringes and Semco cartridges.
No-Clean
| Type | Process | Features | J-STD-004B | RoHs Compliant |
| 670I | No-Clean | Robust Drop-in ready Sn/Pb paste with low residue and non-conductive residues | REL0 | No |
| XP692 | No-Clean | Excellent wettability, extended tack time, yields soft, non-tacky residues | REL0 | No |
| 699 | No-Clean | Halogen-Free paste with excellent wetting and coalescence for fine pitch | ROL0 | No |
| 825HF | No-Clean | Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence | ROL0 | Yes |
| 863 | No-Clean | Halogen-Free technology, low voiding paste with excellent wettability | ROL0 | Yes |
| 866 | No-Clean | Zero-halogen paste with light-colored, pin probable residues | ROL0 | Yes |
| 875 | No-Clean | Halogen-Free formulation with superior low flux spatter | REL0 | Yes |
| 615D | No-Clean | Dispensing solder paste with hard non-conductive residues | REL0 | No |
| 618D | No-Clean | Specifically designed for Pb-Free applications, Easily dispensed for rework applications | ROL0 | Yes |
| 619D | No-Clean | Dispensing solder paste with transparent, pin testable post soldering residues | REL0 | No |
Water-Soluble
| Type | Process | Features | J-STD-004B | RoHs Compliant |
| 787LV | Water-Soluble | Lowest voiding solder paste formulated for fine pitch printing with enhanced stencil life | ORH0 | Yes |
| 788 | Water-Soluble | Non-hygroscopic paste where residues are easily removed, long stencil life | ORL0 | No |
| 792 | Water-Soluble | Robust Sn/Pb paste designed for ultrafine pitch printing, Halide-free, 792 also exhibits excellent performance with Pb-Free alloys | ORM0 | No/Yes |
| 798 | Water-Soluble | Excellent wetting on OSP surfaces, pin testable paste with low residues | ORL0 | No |
| 798LF | Water-Soluble | Water-Soluble paste with enhanced activity for a broad range of applications, Exhibits excellent printing characteristics with easy residue removal properties | ORH0 | Yes |
| XP799 | Water-Soluble | Designed for superior wetting on OSP surfaces with extended stencil life | ORL1 | No |
| 717D | Water-Soluble | Halide-free dispensing paste with easy removal of residues | ORL0 | No |
| 718D | Water-Soluble | Dispensing solder paste designed specifically for Pb-Free applications | ORH0 | Yes |
Rosin-Based
| Type | Process | Features | J-STD-004B | RoHs Compliant |
| 230 | RMA | RMA solder paste that meets no-clean requirements, Excellent soldering performance for both Sn/Pb and lead-free applications | ROM0 | No/Yes |
| 215D | RMA | Dispensing RMA solder paste with hard, non-conductive residues | ROM0 | No/Yes |
| 350 | RA | Robust Sn/Pb formulation for Sn/Pb and lead-free applications | ROM1 | No/Yes |
| 315D | RA | Dispensing solder paste with excellent wettability | ROM0 | No/Yes |
Halogen-Free
| Type | Process | Features | J-STD-004B | RoHs Compliant |
| 699 | No-Clean | Halogen-Free paste with excellent wetting and coalescence for fine pitch | ROL0 | No |
| 825HF | No-Clean | Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence | ROL0 | Yes |
| 863 | No-Clean | Halogen-Free technology, low voiding paste with excellent wettability | ROL0 | Yes |
| 866 | No-Clean | Zero-halogen paste with light-colored, pin probable residues | ROL0 | Yes |
| 875 | No-Clean | Halogen-Free formulation with superior low flux spatter | REL0 | Yes |
Delta Solder Wire
Qualitek utilizes state-of-the-art wire extrusion and wire drawing machines to manufacture low residue/fine diameter wire solders. Many of our formulations use the latest in no-clean/low residue technology found in our solder pastes and solder fluxes. We also developed our flux core manufacturing process to eliminate flux voids and irregular wire. Formulations available for: No-Clean, Water-Soluble, Rosin Mildly Activated, Super Activated Resin and Rosin Activated. Solid wire is also available. Qualitek wire solders meet or exceed J-STD-004B.
Standard Packaging
Wire solder is packaged on spools sizes: 1/2lb., 1lb., 1 Kilogram, 5lb., 10lb., 20lb
No-Clean
| Flux Core | Process | Features | J-STD-004B | RoHs Compliant |
| NC611 | No-Clean | NEW!! No-Clean flux has excellent activity, clear residue and low flux spatter | REL0 | Yes |
| NC600 | No-Clean | No-Clean flux contains a very effective activator and spread like an RA flux. Available with several lead-free and leaded alloys. | REL0 | No/Yes |
| NC601 | No-Clean | No-Clean core flux has excellent spread properties leaving virtually no post-soldering residue. Available with several lead-free and leaded alloys. | ORL0 | No/Yes |
Water-Soluable
| Flux Core | Process | Features | J-STD-004B | RoHs Compliant |
| WS700 | Water-Soluble | Formulated for electronic applications where fast wetting and ease of cleaning with water is required. Available with several lead-free and leaded alloys. | ORH1 | No/Yes |
Rosin-Based
| Flux Core | Process | Features | J-STD-004B | RoHs Compliant |
| RMA200 | Rosin Mildly Activated | Rosin Mildly Activated flux formulated for high reliability electronic assembly. Available with several lead-free and leaded alloys. | ROL0 | No/Yes |
| RA300 | Rosin Activated | Rapid wetting, fast-flowing flux core that contains non-conductive post-soldering residues. Available with several lead-free and leaded alloys. | ROM1 | No/Yes |
| SRA500 | Super Rosin Activated | Super Rosin Activated flux core is recommended for highly oxidized or difficult to solder to metals. Available with lead-free alloys. | ROH1 | Yes |
Qualitek Bar Solders
Qualitek Solder Bar is designed as an alternative to standard Sn/Pb for electronics assembly and is available is both leaded and lead-free alloys (see leaded or lead-free alloy charts for properties). Qualitek Bar Solder conforms and exceeds the impurity requirements of IPC J-STD-006C and all other relevant standards. Q-Bar is made from grade A Virgin metals. Quality standards for all Q-Bar exceed J-STD 006 and ASTM B-32.
Solder Bar Packaging Options
- Q-Bar Tin/Lead 2.2 lbs. each / 22 lbs. per Box
- Q-Bar Lead Free 2.0 lbs. each / 20 lbs. per Box
- Equalizer Bar Tin/Lead 11 lbs. Each / 44 lbs. per Box
- Equalizer Bar Lead-Free 10 lbs. each / 50 lbs. per Box
- Q-Chips 5 lbs. per Box & 50 lb.Pails
Qualitek bar solder is available in a wide variety of alloy compositions. Most may be found by viewing their Standard Alloy Chart and Lead Free Alloy Charts.
Qualitek Soldering Flux
Qualitek offers competitive, state-of-the-art wave solder fluxes for the electronics industry. Qualitek fluxes are manufactured for lead and lead-free processes that include no-clean, VOC-Free, water-soluble and rosin based types. Liquid Fluxes are available in 1, 5 gallon containers and 55 gallon drums.
Alcohol-Based No-Clean
| Flux | Features | S.G.@25°C | % Solids | Acid No. | J-STD-004B | Thinner |
| 302 | No-Clean, Halogen-Free flux with very low solids, may be used for LEADED and LEAD-FREE applications for a broader process window., Best Seller | 0.800 | 2.3 | 20 | ORL0 | 300A |
| 302+ | No-Clean, Halogen-Free flux with low solids. Slightly higher solids lead to increased activity. May be used with LEADED and LEAD-FREE applications. | 0.804 | 3.0 | 29 | ORL0 | 300A |
| 305 | No-Clean, Rosin-based, Halogen-Free flux designed for single and double sided plated through hole boards. Recommended for leaded solder systems. | 0.795 | 5.0 | 25 | ROL0 | 300A |
| 351 | No-Clean, Halogen-Free, non-rosin flux with low solids. Leaves minimal residue. Recommended for use with LEADED systems. | 0.805 | 2.2 | 15 | ORL0 | 300A |
| 360 | No-Clean, Zero halogen, Heat stable flux with a unique solvent system. May be used LEADED and LEAD-FREE systems. | 0.813 | 2.5 | 16 | ORL0 | 300B |
| 355-35 | No-Clean, Halide-Free flux, designed for LEAD-FREE solder systems. Exhibits high activity. | 1.02 | 7.5 | 40 | ORL0 | 300A |
| 380 | No-Clean, Rosin-based flux leads to higher activity. Recommended for LEADED wave applications. | 0.793 | 3.3 | 18.2 | ROL0 | 300A |
| 381 | No-Clean, Low solids flux compatible with both LEADED and LEAD-FREE systems that eliminates skips and shorts often experienced with wave assembly. | 0.800 | 3.7 | 23 | ROL0 | 300A |
| 391S | No-Clean Halogen-Free flux in which virtually no residue remains on the assembly after soldering. Use with LEADED systems. | 0.798 | 2.0 | 18 | ORL0 | 300A |
| 392-35 | No-Clean, Halogen-Free, low solids organic flux with no surface insulation resistance degradation. Produces bright, lustrous solder joints. Designed for LEAD-FREE applications. | 0.811 | 4.0 | 45 | ORL0 | 300A |
Alcohol-Based Water-Soluable
| Flux | Features | S.G.@25°C | % Solids | pH | % Halides | J-STD-004B | Thinner |
| 713N | Water-Soluble, highly active organic flux designed for complete water solubility of post-soldering residues. Designed for LEADED systems. | 0.888 | — | 3.75 | 1.9 | ORH1 | 700T |
| 714N | Water-Soluble, non-spattering formulation designed for high speed soldering operations. Designed for LEADED systems. | 0.842 | — | 8.0 | 1.9 | ORH1 | 700T |
| 735-11 | Water-Soluble flux designed for automated soldering operations where rosin fluxes are not sufficiently active and inorganic fluxes are too corrosive. Designed for LEADED wave systems. | 0.950 | 16 | 2.0 | 3.0 | ORH1 | 700T |
| 737N | Water-Soluble, very active, robust flux with neutral pH that can be used with LEADED or LEAD-FREE solder systems. Best Seller | 0.846 | 17.5 | 7.3 | 2.2 | ORH1 | 700T |
| 775 | Water-Soluble flux designed specifically for high speed LEADED wave soldering applications and water cleaning systems. | 0.873 | — | 3.2 | 1.9 | ORM1 | 700T |
VOC-Free Fluxes (Non-Flammable For Both Leaded And Lead-Free Systems)
| Flux | Features | S.G.@25°C | % Solids | Acid No. | pH | % Halides | J-STD-004B |
| 350NVOC | No-Clean, VOC-Free, water-based, flux designed for mass soldering, Foaming version available. | 1.01 | 4.3 | 20 | — | — | ORL0 |
| 355NVOC | No-Clean, VOC-Free flux is a pin testable formula that remains active after chip wave eliminating solder ball formation. | 1.02 | 5.3 | 34 | — | — | ORL0 |
| 357NVOC | No-Clean, VOC-Free flux with lowest amount of solids leaving virtually no residue. | 1.01 | 1.5 | 22 | — | — | ORL0 |
| 358NVOC | No-Clean, VOC-Free, high reliability flux contains higher solids that increase flux activity. | 1.02 | 8.0 | 55 | ORL0 | ||
| 735VF | Water-Soluble, VOC-Free flux that contains a unique activator that promotes wetting on a variety of metallic substrates, Foaming version available. | 1.05 | 16.5 | — | 2.1 | 3.0 | ORH1 |
| 737NVF | Water Soluble, VOC-Free version of 737N flux so has a neutral pH and formulated to be effective over a broad preheat range. | 1.02 | 12 | — | 7.2 | 2.2 | ORH1 |
Rosin Fluxes (Designed For Leaded Applications)
| Flux | Features | S.G.@25°C | % Solids | J-STD-004B | Thinner |
| 125 | Non-activated flux containing 25% pure white gum rosin. | 0.844 | 25 | ROL0 | 100T |
| 285 | Rosin Mildly Activated flux with activities close to that of a fully activated rosin flux. | 0.875 | 36 | ROL1 | 200T |
| 285-25 | Rosin Mildly Activated flux with only 25% solids. | 0.842 | 25 | ROL1 | 200T |
| 515 | Rosin Activated flux with excellent foaming characteristics. | 0.823 | 19.5 | ROM1 | 500T |
| 525MIL | Rosin Activated flux designed for wave applications where cleanliness exceeds military specification requirements. | 0.837 | 25 | ROM1 | 500T |
| 535MIL | Rosin Activated flux ideal for wave soldering containing 35% solids. | 0.856 | 35 | ROM1 | 500T |
| 545 | Best-selling Rosin Activated flux with superior fluxing and foaming properties. | 0.923 | 50 | ROM1 | 500T |
Lead-Tinning Fluxes
| Flux | Features | S.G.@25°C | % Solids | pH | J-STD-004B | Thinner |
| 813 | Halogen-Free flux best for foaming applications. | 0.870 | 16 | 2.8 | ORM0 | 800T |
| 814 | Halogen-Free flux excellent for lead tinning applications. | 0.942 | 23 | 3.0 | ORM0 | 800T |
| 820 | Halogen-Free, organic flux with higher solids to increase activity. | 0.865 | 27 | 8.3 | ORM0 | 800T |
| 830VHF | VOC-Free, Halogen-Free flux with excellent residue cleanability. | 1.05 | 17 | 2.75 | ORM0 | — |
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