Qualitek

Qualitek has developed several types of high-performance Delta Soldering Products, suitable for printing, dispensing and package-on-package assembly.

Delta Solder Paste

Qualitek has developed several types of high-performance Delta Solder Paste designed for use in Sn/Pb or for Pb-Free circuit board assembly. Qualitek offers No-Clean, RMA (Rosin Mildly Activated), RA (Rosin Activated) and Water-Soluble solder paste types for surface mount assemblies. Delta Solder Paste types are available for printing, dispensing and package-on-package assembly. Delta Solder Paste is available in jars, syringes and Semco cartridges.

Product Brochure

Solder Paste Technical Data & SDS

No-Clean

Type	Process	Features	J-STD-004B	RoHs Compliant
670I	No-Clean	Robust Drop-in ready Sn/Pb paste with low residue and non-conductive residues	REL0	No
XP692	No-Clean	Excellent wettability, extended tack time, yields soft, non-tacky residues	REL0	No
699	No-Clean	Halogen-Free paste with excellent wetting and coalescence for fine pitch	ROL0	No
825HF	No-Clean	Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence	ROL0	Yes
863	No-Clean	Halogen-Free technology, low voiding paste with excellent wettability	ROL0	Yes
866	No-Clean	Zero-halogen paste with light-colored, pin probable residues	ROL0	Yes
875	No-Clean	Halogen-Free formulation with superior low flux spatter	REL0	Yes
615D	No-Clean	Dispensing solder paste with hard non-conductive residues	REL0	No
618D	No-Clean	Specifically designed for Pb-Free applications, Easily dispensed for rework applications	ROL0	Yes
619D	No-Clean	Dispensing solder paste with transparent, pin testable post soldering residues	REL0	No

Water-Soluble

Type	Process	Features	J-STD-004B	RoHs Compliant
787LV	Water-Soluble	Lowest voiding solder paste formulated for fine pitch printing with enhanced stencil life	ORH0	Yes
788	Water-Soluble	Non-hygroscopic paste where residues are easily removed, long stencil life	ORL0	No
792	Water-Soluble	Robust Sn/Pb paste designed for ultrafine pitch printing, Halide-free, 792 also exhibits excellent performance with Pb-Free alloys	ORM0	No/Yes
798	Water-Soluble	Excellent wetting on OSP surfaces, pin testable paste with low residues	ORL0	No
798LF	Water-Soluble	Water-Soluble paste with enhanced activity for a broad range of applications, Exhibits excellent printing characteristics with easy residue removal properties	ORH0	Yes
XP799	Water-Soluble	Designed for superior wetting on OSP surfaces with extended stencil life	ORL1	No
717D	Water-Soluble	Halide-free dispensing paste with easy removal of residues	ORL0	No
718D	Water-Soluble	Dispensing solder paste designed specifically for Pb-Free applications	ORH0	Yes

Rosin-Based

Type	Process	Features	J-STD-004B	RoHs Compliant
230	RMA	RMA solder paste that meets no-clean requirements, Excellent soldering performance for both Sn/Pb and lead-free applications	ROM0	No/Yes
215D	RMA	Dispensing RMA solder paste with hard, non-conductive residues	ROM0	No/Yes
350	RA	Robust Sn/Pb formulation for Sn/Pb and lead-free applications	ROM1	No/Yes
315D	RA	Dispensing solder paste with excellent wettability	ROM0	No/Yes

Halogen-Free

Type	Process	Features	J-STD-004B	RoHs Compliant
699	No-Clean	Halogen-Free paste with excellent wetting and coalescence for fine pitch	ROL0	No
825HF	No-Clean	Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence	ROL0	Yes
863	No-Clean	Halogen-Free technology, low voiding paste with excellent wettability	ROL0	Yes
866	No-Clean	Zero-halogen paste with light-colored, pin probable residues	ROL0	Yes
875	No-Clean	Halogen-Free formulation with superior low flux spatter	REL0	Yes

Delta Solder Wire

Qualitek utilizes state-of-the-art wire extrusion and wire drawing machines to manufacture low residue/fine diameter wire solders. Many of our formulations use the latest in no-clean/low residue technology found in our solder pastes and solder fluxes. We also developed our flux core manufacturing process to eliminate flux voids and irregular wire. Formulations available for: No-Clean, Water-Soluble, Rosin Mildly Activated, Super Activated Resin and Rosin Activated. Solid wire is also available. Qualitek wire solders meet or exceed J-STD-004B.

Standard Packaging

Wire solder is packaged on spools sizes: 1/2lb., 1lb., 1 Kilogram, 5lb., 10lb., 20lb

Wire Solder Technical Data & SDS

No-Clean

Flux Core	Process	Features	J-STD-004B	RoHs Compliant
NC611	No-Clean	NEW!! No-Clean flux has excellent activity, clear residue and low flux spatter	REL0	Yes
NC600	No-Clean	No-Clean flux contains a very effective activator and spread like an RA flux. Available with several lead-free and leaded alloys.	REL0	No/Yes
NC601	No-Clean	No-Clean core flux has excellent spread properties leaving virtually no post-soldering residue. Available with several lead-free and leaded alloys.	ORL0	No/Yes

Water-Soluable

Flux Core	Process	Features	J-STD-004B	RoHs Compliant
WS700	Water-Soluble	Formulated for electronic applications where fast wetting and ease of cleaning with water is required. Available with several lead-free and leaded alloys.	ORH1	No/Yes

Rosin-Based

Flux Core	Process	Features	J-STD-004B	RoHs Compliant
RMA200	Rosin Mildly Activated	Rosin Mildly Activated flux formulated for high reliability electronic assembly. Available with several lead-free and leaded alloys.	ROL0	No/Yes
RA300	Rosin Activated	Rapid wetting, fast-flowing flux core that contains non-conductive post-soldering residues. Available with several lead-free and leaded alloys.	ROM1	No/Yes
SRA500	Super Rosin Activated	Super Rosin Activated flux core is recommended for highly oxidized or difficult to solder to metals. Available with lead-free alloys.	ROH1	Yes

Qualitek Bar Solders

Qualitek Solder Bar is designed as an alternative to standard Sn/Pb for electronics assembly and is available is both leaded and lead-free alloys (see leaded or lead-free alloy charts for properties). Qualitek Bar Solder conforms and exceeds the impurity requirements of IPC J-STD-006C and all other relevant standards. Q-Bar is made from grade A Virgin metals. Quality standards for all Q-Bar exceed J-STD 006 and ASTM B-32.

Solder Bar Packaging Options

Q-Bar Tin/Lead 2.2 lbs. each / 22 lbs. per Box
Q-Bar Lead Free 2.0 lbs. each / 20 lbs. per Box
Equalizer Bar Tin/Lead 11 lbs. Each / 44 lbs. per Box
Equalizer Bar Lead-Free 10 lbs. each / 50 lbs. per Box
Q-Chips 5 lbs. per Box & 50 lb.Pails

Qualitek bar solder is available in a wide variety of alloy compositions. Most may be found by viewing their Standard Alloy Chart and Lead Free Alloy Charts.

Bar Solder Technical Data & SDS

Qualitek Soldering Flux

Qualitek offers competitive, state-of-the-art wave solder fluxes for the electronics industry. Qualitek fluxes are manufactured for lead and lead-free processes that include no-clean, VOC-Free, water-soluble and rosin based types. Liquid Fluxes are available in 1, 5 gallon containers and 55 gallon drums.

Liquid Flux Technical Data & SDS

Alcohol-Based No-Clean

Flux	Features	S.G.@25°C	% Solids	Acid No.	J-STD-004B	Thinner
302	No-Clean, Halogen-Free flux with very low solids, may be used for LEADED and LEAD-FREE applications for a broader process window., Best Seller	0.800	2.3	20	ORL0	300A
302+	No-Clean, Halogen-Free flux with low solids. Slightly higher solids lead to increased activity. May be used with LEADED and LEAD-FREE applications.	0.804	3.0	29	ORL0	300A
305	No-Clean, Rosin-based, Halogen-Free flux designed for single and double sided plated through hole boards. Recommended for leaded solder systems.	0.795	5.0	25	ROL0	300A
351	No-Clean, Halogen-Free, non-rosin flux with low solids. Leaves minimal residue. Recommended for use with LEADED systems.	0.805	2.2	15	ORL0	300A
360	No-Clean, Zero halogen, Heat stable flux with a unique solvent system. May be used LEADED and LEAD-FREE systems.	0.813	2.5	16	ORL0	300B
355-35	No-Clean, Halide-Free flux, designed for LEAD-FREE solder systems. Exhibits high activity.	1.02	7.5	40	ORL0	300A
380	No-Clean, Rosin-based flux leads to higher activity. Recommended for LEADED wave applications.	0.793	3.3	18.2	ROL0	300A
381	No-Clean, Low solids flux compatible with both LEADED and LEAD-FREE systems that eliminates skips and shorts often experienced with wave assembly.	0.800	3.7	23	ROL0	300A
391S	No-Clean Halogen-Free flux in which virtually no residue remains on the assembly after soldering. Use with LEADED systems.	0.798	2.0	18	ORL0	300A
392-35	No-Clean, Halogen-Free, low solids organic flux with no surface insulation resistance degradation. Produces bright, lustrous solder joints. Designed for LEAD-FREE applications.	0.811	4.0	45	ORL0	300A

Alcohol-Based Water-Soluable

Flux	Features	S.G.@25°C	% Solids	pH	% Halides	J-STD-004B	Thinner
713N	Water-Soluble, highly active organic flux designed for complete water solubility of post-soldering residues. Designed for LEADED systems.	0.888	—	3.75	1.9	ORH1	700T
714N	Water-Soluble, non-spattering formulation designed for high speed soldering operations. Designed for LEADED systems.	0.842	—	8.0	1.9	ORH1	700T
735-11	Water-Soluble flux designed for automated soldering operations where rosin fluxes are not sufficiently active and inorganic fluxes are too corrosive. Designed for LEADED wave systems.	0.950	16	2.0	3.0	ORH1	700T
737N	Water-Soluble, very active, robust flux with neutral pH that can be used with LEADED or LEAD-FREE solder systems. Best Seller	0.846	17.5	7.3	2.2	ORH1	700T
775	Water-Soluble flux designed specifically for high speed LEADED wave soldering applications and water cleaning systems.	0.873	—	3.2	1.9	ORM1	700T

VOC-Free Fluxes (Non-Flammable For Both Leaded And Lead-Free Systems)

Flux	Features	S.G.@25°C	% Solids	Acid No.	pH	% Halides	J-STD-004B
350NVOC	No-Clean, VOC-Free, water-based, flux designed for mass soldering, Foaming version available.	1.01	4.3	20	—	—	ORL0
355NVOC	No-Clean, VOC-Free flux is a pin testable formula that remains active after chip wave eliminating solder ball formation.	1.02	5.3	34	—	—	ORL0
357NVOC	No-Clean, VOC-Free flux with lowest amount of solids leaving virtually no residue.	1.01	1.5	22	—	—	ORL0
358NVOC	No-Clean, VOC-Free, high reliability flux contains higher solids that increase flux activity.	1.02	8.0	55			ORL0
735VF	Water-Soluble, VOC-Free flux that contains a unique activator that promotes wetting on a variety of metallic substrates, Foaming version available.	1.05	16.5	—	2.1	3.0	ORH1
737NVF	Water Soluble, VOC-Free version of 737N flux so has a neutral pH and formulated to be effective over a broad preheat range.	1.02	12	—	7.2	2.2	ORH1

Rosin Fluxes (Designed For Leaded Applications)

Flux	Features	S.G.@25°C	% Solids	J-STD-004B	Thinner
125	Non-activated flux containing 25% pure white gum rosin.	0.844	25	ROL0	100T
285	Rosin Mildly Activated flux with activities close to that of a fully activated rosin flux.	0.875	36	ROL1	200T
285-25	Rosin Mildly Activated flux with only 25% solids.	0.842	25	ROL1	200T
515	Rosin Activated flux with excellent foaming characteristics.	0.823	19.5	ROM1	500T
525MIL	Rosin Activated flux designed for wave applications where cleanliness exceeds military specification requirements.	0.837	25	ROM1	500T
535MIL	Rosin Activated flux ideal for wave soldering containing 35% solids.	0.856	35	ROM1	500T
545	Best-selling Rosin Activated flux with superior fluxing and foaming properties.	0.923	50	ROM1	500T

Lead-Tinning Fluxes

Flux	Features	S.G.@25°C	% Solids	pH	J-STD-004B	Thinner
813	Halogen-Free flux best for foaming applications.	0.870	16	2.8	ORM0	800T
814	Halogen-Free flux excellent for lead tinning applications.	0.942	23	3.0	ORM0	800T
820	Halogen-Free, organic flux with higher solids to increase activity.	0.865	27	8.3	ORM0	800T
830VHF	VOC-Free, Halogen-Free flux with excellent residue cleanability.	1.05	17	2.75	ORM0	—