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Qualitek

Qualitek has developed several types of high-performance Delta Soldering Products, suitable for printing, dispensing and package-on-package assembly.

Delta Solder Paste

Qualitek has developed several types of high-performance Delta Solder Paste designed for use in Sn/Pb or for Pb-Free circuit board assembly. Qualitek offers No-Clean, RMA (Rosin Mildly Activated), RA (Rosin Activated) and Water-Soluble solder paste types for surface mount assemblies. Delta Solder Paste types are available for printing, dispensing and package-on-package assembly. Delta Solder Paste is available in jars, syringes and Semco cartridges.

No-Clean
Type Process Features J-STD-004B RoHs Compliant
670I No-Clean Robust Drop-in ready Sn/Pb paste with low residue and non-conductive residues REL0 No
XP692 No-Clean Excellent wettability, extended tack time, yields soft, non-tacky residues REL0 No
699 No-Clean Halogen-Free paste with excellent wetting and coalescence for fine pitch ROL0 No
825HF No-Clean Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence ROL0 Yes
863 No-Clean Halogen-Free technology, low voiding paste with excellent wettability ROL0 Yes
866 No-Clean Zero-halogen paste with light-colored, pin probable residues ROL0 Yes
875 No-Clean Halogen-Free formulation with superior low flux spatter REL0 Yes
615D No-Clean Dispensing solder paste with hard non-conductive residues REL0 No
618D No-Clean Specifically designed for Pb-Free applications, Easily dispensed for rework applications ROL0 Yes
619D No-Clean Dispensing solder paste with transparent, pin testable post soldering residues REL0 No
Water-Soluble
Type Process Features J-STD-004B RoHs Compliant
787LV Water-Soluble Lowest voiding solder paste formulated for fine pitch printing with enhanced stencil life ORH0 Yes
788 Water-Soluble Non-hygroscopic paste where residues are easily removed, long stencil life ORL0 No
792 Water-Soluble Robust Sn/Pb paste designed for ultrafine pitch printing, Halide-free, 792 also exhibits excellent performance with Pb-Free alloys ORM0 No/Yes
798 Water-Soluble Excellent wetting on OSP surfaces, pin testable paste with low residues ORL0 No
798LF Water-Soluble Water-Soluble paste with enhanced activity for a broad range of applications, Exhibits excellent printing characteristics with easy residue removal properties ORH0 Yes
XP799 Water-Soluble Designed for superior wetting on OSP surfaces with extended stencil life ORL1 No
717D Water-Soluble Halide-free dispensing paste with easy removal of residues ORL0 No
718D Water-Soluble Dispensing solder paste designed specifically for Pb-Free applications ORH0 Yes
Rosin-Based
Type Process Features J-STD-004B RoHs Compliant
230 RMA RMA solder paste that meets no-clean requirements, Excellent soldering performance for both Sn/Pb and lead-free applications ROM0 No/Yes
215D RMA Dispensing RMA solder paste with hard, non-conductive residues ROM0 No/Yes
350 RA Robust Sn/Pb formulation for Sn/Pb and lead-free applications ROM1 No/Yes
315D RA Dispensing solder paste with excellent wettability ROM0 No/Yes
Halogen-Free
Type Process Features J-STD-004B RoHs Compliant
699 No-Clean Halogen-Free paste with excellent wetting and coalescence for fine pitch ROL0 No
825HF No-Clean Halogen-Free paste designed for fine pitch printing with excellent wetting and coalescence ROL0 Yes
863 No-Clean Halogen-Free technology, low voiding paste with excellent wettability ROL0 Yes
866 No-Clean Zero-halogen paste with light-colored, pin probable residues ROL0 Yes
875 No-Clean Halogen-Free formulation with superior low flux spatter REL0 Yes

Delta Solder Wire

Qualitek utilizes state-of-the-art wire extrusion and wire drawing machines to manufacture low residue/fine diameter wire solders. Many of our formulations use the latest in no-clean/low residue technology found in our solder pastes and solder fluxes. We also developed our flux core manufacturing process to eliminate flux voids and irregular wire. Formulations available for: No-Clean, Water-Soluble, Rosin Mildly Activated, Super Activated Resin and Rosin Activated. Solid wire is also available. Qualitek wire solders meet or exceed J-STD-004B.

Standard Packaging

Wire solder is packaged on spools sizes: 1/2lb., 1lb., 1 Kilogram, 5lb., 10lb., 20lb

No-Clean
Flux Core Process Features J-STD-004B RoHs Compliant
NC611 No-Clean NEW!! No-Clean flux has excellent activity, clear residue and low flux spatter REL0 Yes
NC600 No-Clean No-Clean flux contains a very effective activator and spread like an RA flux. Available with several lead-free and leaded alloys. REL0 No/Yes
NC601 No-Clean No-Clean core flux has excellent spread properties leaving virtually no post-soldering residue.  Available with several lead-free and leaded alloys. ORL0 No/Yes
Water-Soluable
Flux Core Process Features J-STD-004B RoHs Compliant
WS700 Water-Soluble Formulated for electronic applications where fast wetting and ease of cleaning with water is required. Available with several lead-free and leaded alloys. ORH1 No/Yes
Rosin-Based
Flux Core Process Features J-STD-004B RoHs Compliant
RMA200 Rosin Mildly Activated Rosin Mildly Activated flux formulated for high reliability electronic assembly. Available with several lead-free and leaded alloys. ROL0 No/Yes
RA300 Rosin Activated Rapid wetting, fast-flowing flux core that contains non-conductive post-soldering residues. Available with several lead-free and leaded alloys. ROM1 No/Yes
SRA500 Super Rosin Activated Super Rosin Activated flux core is recommended for highly oxidized or difficult to solder to metals.  Available with lead-free alloys. ROH1 Yes

Qualitek Bar Solders

Qualitek Solder Bar is designed as an alternative to standard Sn/Pb for electronics assembly and is available is both leaded and lead-free alloys (see leaded or lead-free alloy charts for properties). Qualitek Bar Solder conforms and exceeds the impurity requirements of IPC J-STD-006C and all other relevant standards. Q-Bar is made from grade A Virgin metals. Quality standards for all Q-Bar exceed J-STD 006 and ASTM B-32.

Solder Bar Packaging Options

  • Q-Bar Tin/Lead 2.2 lbs. each / 22 lbs. per Box
  • Q-Bar Lead Free 2.0 lbs. each / 20 lbs. per Box
  • Equalizer Bar Tin/Lead 11 lbs. Each / 44 lbs. per Box
  • Equalizer Bar Lead-Free 10 lbs. each / 50 lbs. per Box
  • Q-Chips 5 lbs. per Box & 50 lb.Pails

Qualitek bar solder is available in a wide variety of alloy compositions. Most may be found by viewing their Standard Alloy Chart and Lead Free Alloy Charts.

Qualitek Soldering Flux

Qualitek offers competitive, state-of-the-art wave solder fluxes for the electronics industry. Qualitek fluxes are manufactured for lead and lead-free processes that include no-clean, VOC-Free, water-soluble and rosin based types. Liquid Fluxes are available in 1, 5 gallon containers and 55 gallon drums.

Alcohol-Based No-Clean
Flux Features S.G.@25°C % Solids Acid No. J-STD-004B Thinner
302 No-Clean, Halogen-Free flux with very low solids, may be used for LEADED and LEAD-FREE applications for a broader process window., Best Seller 0.800 2.3 20 ORL0 300A
302+ No-Clean, Halogen-Free flux with low solids.  Slightly higher solids lead to increased activity.  May be used with LEADED and LEAD-FREE applications. 0.804 3.0 29 ORL0 300A
305 No-Clean, Rosin-based, Halogen-Free flux designed for single and double sided plated through hole boards. Recommended for leaded solder systems. 0.795 5.0 25 ROL0 300A
351 No-Clean, Halogen-Free, non-rosin flux with low solids.  Leaves minimal residue.  Recommended for use with LEADED systems. 0.805 2.2 15 ORL0 300A
360 No-Clean, Zero halogen, Heat stable flux with a unique solvent system.  May be used LEADED and LEAD-FREE systems. 0.813 2.5 16 ORL0 300B
355-35 No-Clean, Halide-Free flux, designed for LEAD-FREE solder systems. Exhibits high activity. 1.02 7.5 40 ORL0 300A
380 No-Clean, Rosin-based flux leads to higher activity.         Recommended for LEADED wave applications. 0.793 3.3 18.2 ROL0 300A
381 No-Clean, Low solids flux compatible with both LEADED and LEAD-FREE systems that eliminates skips and shorts often experienced with wave assembly. 0.800 3.7 23 ROL0 300A
391S No-Clean Halogen-Free flux in which virtually no residue remains on the assembly after soldering.  Use with LEADED systems. 0.798 2.0 18 ORL0 300A
392-35 No-Clean, Halogen-Free, low solids organic flux with no surface insulation resistance degradation. Produces bright, lustrous solder joints.  Designed for LEAD-FREE applications. 0.811 4.0 45 ORL0 300A
Alcohol-Based Water-Soluable
Flux Features S.G.@25°C % Solids pH % Halides J-STD-004B Thinner
713N Water-Soluble, highly active organic flux designed for complete water solubility of post-soldering residues.  Designed for LEADED systems. 0.888 3.75 1.9 ORH1 700T
714N Water-Soluble, non-spattering formulation designed for high speed soldering operations.  Designed for LEADED systems. 0.842 8.0 1.9 ORH1 700T
735-11 Water-Soluble flux designed for automated soldering operations where rosin fluxes are not sufficiently active and inorganic fluxes are too corrosive.  Designed for LEADED wave systems. 0.950 16 2.0 3.0 ORH1 700T
737N Water-Soluble, very active, robust flux with neutral pH that can be used with LEADED or LEAD-FREE solder systems.  Best Seller 0.846 17.5 7.3 2.2 ORH1 700T
775 Water-Soluble flux designed specifically for high speed LEADED wave soldering applications and water cleaning systems. 0.873 3.2 1.9 ORM1 700T
VOC-Free Fluxes (Non-Flammable For Both Leaded And Lead-Free Systems)
Flux Features S.G.@25°C % Solids Acid No. pH % Halides J-STD-004B
350NVOC No-Clean, VOC-Free, water-based, flux designed for mass soldering, Foaming version available. 1.01 4.3 20 ORL0
355NVOC No-Clean, VOC-Free flux is a pin testable formula that remains active after chip wave eliminating solder ball formation. 1.02 5.3 34 ORL0
357NVOC No-Clean, VOC-Free flux with lowest amount of solids leaving virtually no residue. 1.01 1.5 22 ORL0
358NVOC No-Clean, VOC-Free, high reliability flux contains higher solids that increase flux activity. 1.02 8.0 55 ORL0
735VF Water-Soluble, VOC-Free flux that contains a unique activator that promotes wetting on a variety of metallic substrates, Foaming version available. 1.05 16.5 2.1 3.0 ORH1
737NVF Water Soluble, VOC-Free version of 737N flux so has a neutral pH and formulated to be effective over a broad preheat range. 1.02 12 7.2 2.2 ORH1
Rosin Fluxes (Designed For Leaded Applications)
Flux Features S.G.@25°C % Solids J-STD-004B Thinner
125 Non-activated flux containing 25% pure white gum rosin. 0.844 25 ROL0 100T
285 Rosin Mildly Activated flux with activities close to that of a fully activated rosin flux. 0.875 36 ROL1 200T
285-25 Rosin Mildly Activated flux with only 25% solids. 0.842 25 ROL1 200T
515 Rosin Activated flux with excellent foaming characteristics. 0.823 19.5 ROM1 500T
525MIL Rosin Activated flux designed for wave applications where cleanliness exceeds military specification requirements. 0.837 25 ROM1 500T
535MIL Rosin Activated flux ideal for wave soldering containing 35% solids. 0.856 35 ROM1 500T
545 Best-selling Rosin Activated flux with superior fluxing and foaming properties. 0.923 50 ROM1 500T
Lead-Tinning Fluxes
Flux Features S.G.@25°C % Solids pH J-STD-004B Thinner
813 Halogen-Free flux best for foaming applications. 0.870 16 2.8 ORM0 800T
814 Halogen-Free flux excellent for lead tinning applications. 0.942 23 3.0 ORM0 800T
820 Halogen-Free, organic flux with higher solids to increase activity. 0.865 27 8.3 ORM0 800T
830VHF VOC-Free, Halogen-Free flux with excellent residue cleanability. 1.05 17 2.75 ORM0

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